Timeon Kairos Polytechnic Cut Off Mark 2023/2024 Academic Session
If you are aspiring to study at Timeon Kairos Polytechnic in the 2023/2024 academic session, you must be wondering about the cut-off mark and other admission-related information. In this blog post, we provide you with all the essential details you need to know, including the minimum cut-off mark, departmental cut-off mark, and other campus-related updates.
Timeon Kairos Poly Cut Off Mark 2023:
The management of Timeon Kairos Polytechnic has officially released the cut-off mark for the 2023/2024 academic session. The minimum cut-off mark for all programs offered by the institution is set at 160. This means that all 2023 JAMB candidates who scored 160 and above, and selected Timeon Kairos Polytechnic as their choice of institution, are eligible to purchase the admission form.
Departmental Cut Off Mark:
After the release of the departmental cut-off mark by Timeon Kairos Polytechnic, prospective students are required to meet the cut-off mark for their selected department in order to gain admission into any of the programs offered by the institution. Meeting the departmental cut-off mark ensures a good chance of gaining admission into the institution to study your preferred program.
Frequently Asked Questions (FAQ):
- Does Timeon Kairos Poly accept 150? No, Timeon Kairos Polytechnic does not accept a cut-off mark of 150. The minimum acceptable score is 160.
- Is meeting Timeon Kairos Poly’s cut-off mark the only criterion for gaining admission into the institution? Yes, meeting the 160 Timeon Kairos Poly minimum score requirement is a fundamental criterion for admission into the institution.
- Can I enter Timeon Kairos Poly with 170? Yes! You can. The minimum cut-off mark score is 160, and candidates who score 160 and above have a chance of being admitted.
Conclusion:
Congratulations on your interest in Timeon Kairos Polytechnic! The minimum cut-off mark for the 2023/2024 academic session is 160, and this applies to all courses offered by the institution.